Amphenol CIT introduces the next evolution in “push-on” connector technology with a new product line of pre-tinned and embossed SMP and SMPM connector bodies for PCB applications.
Pre-tinned PCB-mount connectors remove cost by reducing time to install while increasing the reliability of solder joints onto the board. In addition, pre-tinned mounting surfaces help to prevent corrosion and oxidization before and after assembly.
The embossed feature under the connector body allows gases to escape when high heat is applied during the wave solder process, thus preventing the “popcorn effect."
SMP and SMPM connectors with pre-tin and “Boss” features will mate with standard cable-mounted connectors as well as with standard female-to-female adapters (commonly referred to as "bullet") which can tolerate radial and axial misalignment to provide a blind-mate interconnect solution between male connectors when stacking boards. Amphenol CIT’s SMP and SMPM connectors can also withstand multiple engagement/disengagement cycles without degradation in electrical performance. SMP and SMPM connectors are also designed to satisfy the demand for increased package density and reduced weight in microwave systems. Subminiature, lightweight, blind-mateable interconnects are ideal for complex high-performance microwave modules and systems where size and weight are primary considerations.
Material | Finish |
---|---|
Metal | Specification |
BeCu (Beryllium Copper) | ASTM B 196 and/or ASTM B 197 |
Brass | ASTM B 36, B121, B16, B16M |
Stainless Steel | ASTM A484/ A582 or A555/581 |
Dielectric | Specification |
Virgin PTFE Fluorocarbon | ASTM D 1710 and ASTM D 1457 |
Polyamide-imide | ASTM D5204 Group 2 Class 1 |
Finish | Specification |
Gold (50u in. Typical) | ASTM-B488 Type 1, Class 1.25 |
Nickel (100u in. Typical) | SAE AMS-QQ-N-290 |
Pasivation | ASTM A967 |
Parameter | Specification | |||||
---|---|---|---|---|---|---|
SMP | SMPM | |||||
Impedance | 50 Ω | |||||
Frequency Range | DC to 40 GHz | DC to 65 GHz | ||||
Insertion Loss | 0.1 x √ f(GHz) | 0.13 x √ f(GHz) | ||||
VSWR | See Product Drawings in Data Sheet | |||||
DWV @ Sea Level | 500 VRMS | |||||
Insulation Resistance | 5000 MΩ (min) | |||||
RF High Pot | 325 VRMS @ 5 MHz | |||||
Insulation Resistance | 5,000 MΩ (min) | |||||
RF High Pot | 325 VRMS @ 5 MHz | |||||
Force to Engage | Full Detent | 15 lbs typical | 6.5 lbs typical | |||
Limited Detent | 7 lbs typical | N/A | ||||
Smooth Bore | 2 lbs typical | 1.5 lbs typical | ||||
Force to Disengage | Full Detent | 5 lbs typical | 5 lbs typical | |||
Limited Detent | 3 lbs typical | N/A | ||||
Smooth Bore | 0.5 lbs typical | 15 lbs typical | ||||
Temperature Range | -65 ºC to +165 ºC | |||||
Thermal Shock | MIL-STD-202, Method 107, Cond B | |||||
Moisture Resistance | MIL-STD-202, Method 106, except step 7b | |||||
Corrosion | MIL-STD-202. Method 101, Cond B | |||||
Vibration | MIL-STD-202, Method 204, Cond D | |||||
Shock | MIL-STD-202, Method 213, Cond I |
Pre-Tinned Push-On PCB Connectors product information
To inquire about Pre-Tinned Push-On “Boss” PCB Connectors available from Amphenol CIT, please fill out the form below, and one of our Sales Engineers will contact you.
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